Key Applications

• Hyperconverged Infrastructure
• Scale-Out Object Storage
• Back-up & Recovery

Key Features

• Two hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
• Socket P+ (LGA 4189) support 3rd Gen Intel® Xeon® Scalable processors
• Intel® C621A
• 20 DIMM Slots (16 DIMM Slots + 4 Intel® Optane™ Persistent Memory Slots)
• 1 PCI-E 4.0 x16 (LP) slot;
• 2 PCI-E 4.0 x8 (LP) slot;
• Tool-less support
• Internal PCI-E 3.0 x8 for 2 M.2 NVMe/SATA support onboard
• Optional NVMe Boot Controller via AOC-SMG3-2M2-B
• Network connectivity via AIOM (OCP 3.0 compliant)
• 6 Hot-swap 3.5″ drive bays; 6 PCI-E 4.0 NVMe/SATA 3.5″ drives
• 2 cooling fans per node, 14.9K RPM
• Liquid Cooling Support
• 2200W Redundant Power Supplies Titanium Level (96%+); Shared Power Design