Key Applications

• High Performance Computing
• Hyper-Converged Infrastructure
• Big Data / Big Science
• Oil immersion, Liquid Cooling

Key Features

• Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:
• Dual Socket P+ (LGA-4189) 3rd Generation Intel® Xeon® Scalable Processors
• Intel® C621A chipset
• 16 DIMMs, Up to 4TB 3DS ECC DDR4-3200 LRDIMM/RDIMM
• 2 PCI-E 4.0 x16 (LP), 1 PCI-E 4.0 x8 (with M.2 adapter installed for support 2 NVME up to 22×80 mm)
• Intel® X710 Dual port 10GBase-T LAN onboard
• 3x 3.5″ hot-swap SATA/SAS drive bays
• 4 heavy duty 8cm PWM fans with optimal fan speed control (Per System)
• Two 2200W redundant power supplies with PMBus
• ASPEED AST2600 BMC, 2 USB, VGA. RoT, 2 SATADOM ports
• Broadcom® 3108 SAS (12Gbps); 3 slots per node; RAID 0, 1, 5, 6 support.