Key Applications

• Software-defined Storage
• In-Memory Computing
• Scale Out All-Flash NVMe Storage
• Data Intensive HPC
• Private & Hybrid Cloud
• NVMe Over Fabrics Solution
• Enhanced Graphics&AI
• Generative AI

Key Features

1. Dual Socket E2 (LGA-4710) Intel® Xeon® 6 6700 series processors with E-cores
   Support CPU TDP up to 300W with air cooling
2. Up to 32 DIMMs supporting up to 8TB DDR5-6400 in 2DPC
3. Flexible networking with up to 2 OCP 3.0 compatible AIOM slots
4. Up to 2 PCIe 5.0 x16 FHHL + 2 PCIe 5.0 x16 AIOM slots
5. Up to 16 front hot-swap E3.S 1T NVMe drive bays
6. Up to 2 single-width GPUs (Max TDP 300W)