Key Applications

• Multi-Access Edge Computing
• Outdoor DU of 5G Application
• Flex-RAN, Open-RAN vBBU

Key Features

• Socket P+ (LGA-4189) support 3rd Gen Intel® Xeon® Scalable processors
• 8 DIMMs; Up to 2TB 3DS ECC DDR4-3200: RDIMM/LRDIMM
• 2x 2.5″ drive bays; 1 M.2 NVMe OR 1 M.2 SATA3
• 6 heavy duty fans with optimal fan speed control; 1 Air Shroud(s)
• 600W Redundant Power Supplies Level (92%+)